HDI board
HDI boards with laser-drilled microvias and blind/buried vias, supporting arbitrary layer interconnects for smartphones, wearables, and other high-density electronics.
Technical Specifications
| Layers | 4-20 Layer |
| Panel | FR-4, Halogen-Free |
| Minimum Line Width/Spacing | 2.5mil/2.5mil |
| Minimum aperture | 0.075mm (laser hole) |
| Plate Thickness | 0.4-3.2mm |
| Surface Finish | ENIG, Immersion Silver, OSP |
| Copper Thickness | 0.5OZ-2OZ |
| Impedance Control | ±5% |
Application Areas
Smartphone motherboardWearable devicesTabletPremium Consumer Electronics
Quality Certification
ISO 9001ISO 14001UL Certification
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